admin 发表于 2025-3-30 14:16:57

半导体行业主要岗位

以下是半导体行业主要岗位的中英文名称及英文简称汇总,按职能领域分类整理:‌一、研发与设计(R&D & Design)‌
[*]‌设计工程师‌
[*]英文:Design Engineer
[*]简称:DE

[*]‌模拟电路设计工程师‌
[*]英文:Analog Circuit Design Engineer
[*]简称:ACDE

[*]‌数字电路设计工程师‌
[*]英文:Digital Circuit Design Engineer
[*]简称:DCDE

[*]‌射频(RF)设计工程师‌
[*]英文:RF Design Engineer
[*]简称:RFDE

[*]‌版图设计工程师‌
[*]英文:Layout Design Engineer
[*]简称:LDE

[*]‌验证工程师‌
[*]英文:Verification Engineer
[*]简称:VE

[*]‌系统架构师‌
[*]英文:System Architect
[*]简称:SA

[*]‌IP核开发工程师‌
[*]英文:IP Core Development Engineer
[*]简称:IPDE

‌二、工艺与制造(Process & Manufacturing)‌
[*]‌工艺工程师‌
[*]英文:Process Engineer
[*]简称:PE

[*]‌工艺整合工程师‌
[*]英文:Process Integration Engineer
[*]简称:PIE

[*]‌光刻工程师‌
[*]英文:Lithography Engineer
[*]简称:LE

[*]‌蚀刻工程师‌
[*]英文:Etch Engineer
[*]简称:EE

[*]‌薄膜沉积工程师‌
[*]英文:Thin Film Deposition Engineer
[*]简称:TFDE

[*]‌CMP工程师‌(化学机械平坦化)
[*]英文:CMP Engineer
[*]简称:CMPE

[*]‌扩散工程师‌
[*]英文:Diffusion Engineer
[*]简称:DE

[*]‌设备工程师‌
[*]英文:Equipment Engineer
[*]简称:EE

‌三、测试与封装(Test & Packaging)‌
[*]‌测试工程师‌
[*]英文:Test Engineer
[*]简称:TE

[*]‌产品测试工程师‌
[*]英文:Product Test Engineer
[*]简称:PTE

[*]‌封装设计工程师‌
[*]英文:Packaging Design Engineer
[*]简称:PDE

[*]‌封装工艺工程师‌
[*]英文:Packaging Process Engineer
[*]简称:PPE

[*]‌可靠性工程师‌
[*]英文:Reliability Engineer
[*]简称:RE

[*]‌失效分析工程师‌
[*]英文:Failure Analysis Engineer
[*]简称:FAE

‌四、质量与项目管理(Quality & PM)‌
[*]‌质量保证工程师‌
[*]英文:Quality Assurance Engineer
[*]简称:QAE

[*]‌质量控制工程师‌
[*]英文:Quality Control Engineer
[*]简称:QCE

[*]‌项目经理‌
[*]英文:Project Manager
[*]简称:PM

[*]‌生产计划工程师‌
[*]英文:Production Planning Engineer
[*]简称:PPE

‌五、供应链与采购(Supply Chain & Procurement)‌
[*]‌供应链管理工程师‌
[*]英文:Supply Chain Management Engineer
[*]简称:SCME

[*]‌采购工程师‌
[*]英文:Procurement Engineer
[*]简称:PE

[*]‌物流经理‌
[*]英文:Logistics Manager
[*]简称:LM

‌六、销售与技术支持(Sales & Technical Support)‌
[*]‌销售工程师‌
[*]英文:Sales Engineer
[*]简称:SE

[*]‌现场应用工程师‌
[*]英文:Field Application Engineer
[*]简称:FAE

[*]‌技术客户经理‌
[*]英文:Technical Account Manager
[*]简称:TAM

‌七、新兴技术与跨领域岗位‌
[*]‌AI芯片设计工程师‌
[*]英文:AI Chip Design Engineer
[*]简称:AICDE

[*]‌功率器件工程师‌
[*]英文:Power Device Engineer
[*]简称:PDE

[*]‌MEMS设计工程师‌(微机电系统)
[*]英文:MEMS Design Engineer
[*]简称:MDE

[*]‌ESD工程师‌(静电防护)
[*]英文:ESD Engineer
[*]简称:ESDE

‌八、其他支持类岗位‌
[*]‌EDA工具工程师‌
[*]英文:EDA Tool Engineer
[*]简称:EDA TE

[*]‌专利工程师‌
[*]英文:Patent Engineer
[*]简称:PE

[*]‌安全与环保工程师‌
[*]英文:EHS Engineer(Environment, Health, Safety)
[*]简称:EHS

‌备注‌
[*]‌简称可能因公司或地区差异而不同‌,例如FAE可能同时指 ‌失效分析工程师‌(Failure Analysis Engineer)和 ‌现场应用工程师‌(Field Application Engineer)。
[*]‌跨领域岗位‌(如AI芯片设计)需结合具体技术方向。
希望这份汇总能为您提供参考!如需补充或调整,请随时告知。
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